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Innovation

The eSurface process allows circuits to be added to any type or shape substrate including unclad and non-planar. This unlimited list of new substrates will bring about innovation and flexibility for the new technology design world like never before.

Cost Savings

The eSurface process reduces costs by 65% due to the elimination of etching manufacturing processes used in copper lamination, by utilizing unclad materials, with lower capital expenditures (and equipment conversion), that extends to lower overhead.

Green Effect

The new eSurface process is an additive process that utilizes Standard "off the shelf" chemical components virtually eliminating the existence of toxic waste in the PCB manufacturing process bringing an extreme green future.